Agent Products/ BRANDS /
System 133-300mm Large-scale Plasma Etching and Deposition EquipmentSystem 133-300mm Large-scale Plasma Etching and Deposition Equipment
Features and benefits System 133-300MM Product DescriptionThe System133 process equipment has 300mm large-scale and large-volume etching and deposition capabilities, flexible configuration, and can perform ICP, RIE, PECVD and ICP-PECVD (HD-PECVD) processes, and can be used for a variety of materials and devices.
DESCRIPTION
Product advantages
300mm single wafer processing capacity, industry-leading batch processing capacity: 20 x 2" , 8 x 3" , 4 x 4"
Choose from single wafer/batch or cassette injection with vacuum manifold. The PlasmalabSystem 133 can be integrated into a cluster system with a central robot for wafer transfer and full cassette-to-cassette wafer transfer in the production process.
Controls substrate temperature using a series of electrodes ranging from -150°C to 700°C
Endpoint detection using laser interferometry and/or optical emission spectroscopy can be installed in the PlasmalabSystem133 for enhanced etch control
Optional 4-, 8-, or 12-way gas tanks provide flexibility in process flow and process gas selection and can be placed remotely, away from main process equipment
Process
Contact us for processes for 300mm and high volume applications such as:
High Brightness LEDs: Industry-leading volume production performance: GaNA, AlGaN and related materials; Sapphire and SiC substrate etch
300 mm SiO2, SiNx deposition
Deposition and etching of diamond-like carbon (DLC)
High volume plasma etch and deposition equipment
