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Physical Vapor Deposition System PVDPhysical Vapor Deposition System PVD
Features and benefits Typical Applications:High-quality Al (including Si/Cu/Ti)
Diffusion barrier layers: TiN, TiW (reactive sputtering)
Resistor thin films (NiCr, TaN)
Precious metals: Au, Pt
Contact window：sales@scientek-co.com
DESCRIPTION
Product Description:
Physical Vapor Deposition (PVD)
Features:
Excellent step coverage
Standard methods for high-quality Al (including Si/CuTi), TiN, TiW
Maximum of 4 x 200mm or 8 x 75mm cathodes
Substrates placed on a rotating stage
Substrate stage with water cooling/heating capability (up to 400oC)
Pre-sputtering and RF biasing
Parameters: gas flow, pressure, RF power
