Product Information/ PRODUCTS /​Intelligent Semi-Automatic Wafer Dicing Machine

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​Intelligent Semi-Automatic Wafer Dicing Machine
​Intelligent Semi-Automatic Wafer Dicing Machine
​Intelligent Semi-Automatic Wafer Dicing Machine

​Intelligent Semi-Automatic Wafer Dicing Machine(MC-10)

specification：

This product is a fast and accurate wafer dicing machine designed for semiconductors and various crystal phase chips.

 

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DESCRIPTION

Product Features:

  • High-quality cross-section
  • High precision (+/- 5um)
  • Fast - completed in less than 1 minute
  • Compact machine size
  • Easy and cost-effective maintenance

Product Applications:

  • Single crystal Si wafer
  • GaN
  • SiC
  • InP