Product Information/ PRODUCTS /SITA Surface tension measurement T15/T100
SITA Surface tension measurement T15/T100SITA DynoTester+ SITA pro line t15 SITA science line t100
specification：
Applications:
- Paints/Inks: The dynamic surface tension of ink affects different characteristics such as wetting, droplet size, permeability, drying, and leveling ability.
- Cleaning Process Monitoring: Prior to surface treatment or spray coating, metal components must be thoroughly cleaned to avoid any impact on subsequent processes. Continuous monitoring of dynamic surface tension enables control over the concentration of interface-active agents to verify the cleaning capability of the cleaning tank. The concentration of the cleaning agent should be maintained within an appropriate range—not too high or too low. Excessive concentration can lead to new contamination and increased production costs, while a concentration that is too low may fail to meet the cleaning requirements.
- Semiconductor: Addition of special cutting and CMP (Chemical Mechanical Polishing) fluids during wafer cutting and polishing.
- Semiconductor: Hydroxide Tetramethylammonium (TMAH) solution is a commonly used developer in etching. Monitoring the surface tension of the interface-active agent ensures a stable etching process.
Contact window： gary.chang@scientek-co.com
DESCRIPTION
Applications:
- Paints/Inks: The dynamic surface tension of ink affects different characteristics such as wetting, droplet size, permeability, drying, and leveling ability.
- Cleaning Process Monitoring: Prior to surface treatment or spray coating, metal components must be thoroughly cleaned to avoid any impact on subsequent processes. Continuous monitoring of dynamic surface tension enables control over the concentration of interface-active agents to verify the cleaning capability of the cleaning tank. The concentration of the cleaning agent should be maintained within an appropriate range—not too high or too low. Excessive concentration can lead to new contamination and increased production costs, while a concentration that is too low may fail to meet the cleaning requirements.
- Semiconductor: Addition of special cutting and CMP (Chemical Mechanical Polishing) fluids during wafer cutting and polishing.
- Semiconductor: Hydroxide Tetramethylammonium (TMAH) solution is a commonly used developer in etching. Monitoring the surface tension of the interface-active agent ensures a stable etching process.
